The shift toward SDVs is leading to cloud-based workflows, virtual testing, and continuous integration pipelines.

EPC Space has announced the EPC7030MSH, a radiation-hardened 300-V GaN FET for high-voltage, high-power space applications.

Microchip has added secure code signing, FOTA updates, and CRA compliance to its ECC608 TrustMANAGER authentication IC.

ST’s L9800 combines eight low-side drivers with diagnostics and protection in a compact leadless package for tight automotive ...

xMEMS is bringing its µCooling fan-on-chip platform to AI-driven extended reality (XR) smart glasses. The silicon-based solid ...

The SKY63104/5/6 family of jitter-attenuating clocks and the SKY62101 clock generator simultaneously generate ultra-low jitter clocks for synchronous Ethernet and spread-spectrum PCIe. Built on ...

There are numerous evergreen chips in the semiconductor industry, and this blog provides a sneak peek at some of these ...

Using the Take Back Half approach to effectively “take back” the error terms for theoretically zero integral nonlinearity.

Using a reconfigured common-mode choke as an isolation transformer to analyze the open-loop response of a Peltz oscillator.

Figure 1 The new tools aim to dramatically reduce risk and enhance the design, yield, and reliability of complex, next-generation 2.5D/3D IC designs. Source: Siemens EDA “These solutions help ...

How much would you pay for a limited-edition new wearable product? If you’re anything like this engineer: a pretty penny.