Yet when it’s time to send a design to manufacturing, many organizations still fall back on a process that hasn’t fundamentally changed in decades – export Gerbers, generate drill files, create ...

Knowing which PCB specification changes require new tooling and which do not can help designers and buyers reduce nonrecurring engineering costs while avoiding unnecessary delays. NRE (nonrecurring ...

UCIe channels are short, dense, highly parallelized and forced into a packaging environment requiring multiple layers. The ...

A basic comparison between CoWoS, wafer-scale integration, and CoWoP establishes distinctions among package substrate, ...

Abstract: Three-dimensional (3D) integration continues to advance Moore’s Law by facilitating dense interconnects and enabling multi-tier system architectures. Among the various integration approaches ...

The recently released Valve Steam Machine is that it uses a custom, non-standard PCB and non-standard power supply. This fact ...

The megatrend in electronic design today is end-to-end collaboration across ICs, packaging, PCBs, systems, data centers, and ...