ByteDance is racing to finalize the design of a next-generation in-house CPU by early 2027 at the latest, with mass production and wider deployment targeted for the second half of that year, South ...

Mizuho Securities Asia has increased its forecast for Taiwan Semiconductor Manufacturing Co.s (TSMC) advanced CoWoS packaging ...

Mizuho Securities Asia raised its forecast for TSMC's monthly CoWoS packaging capacity to 140,000 units by 2026 and 190,000–200,000 units by 2027, up from prior estimates of 120,000 and ...

Wells Fargo lifted server CPU revenue forecasts sharply (to $25B by 2028) and assumes AI-driven server CPU demand stays ...

TeraPlast has finalized the acquisition of the MASA polyethylene pipe manufacturing facility in Spain, previously part of ...

AI agents waste massive cloud space, so block this bloat early with strict policy checks, illustrated using Terraform and ...

Can a company still known for smartphone chips really become a force in the data center?

AMD's AI GPU position is strengthened by hyperscaler diversification needs, with multi-year, multi-gigawatt deals from Meta ...

Agency of Agriculture, Food & Markets This grant helps fund the purchase of equipment for dairy processing and packaging to ...

Cloud render farms for 3ds Max and Cinema 4D have moved from an occasional option to a standard production infrastructure, ...

Chinese chipmaker Hygon has announced a new lineup of hardware designed for the data center and artificial intelligence markets. The launch ...

Qualcomm and Meta have announced a collaboration on a multi-generation roadmap for CPU products supporting Meta’s growing compute footprint ...