AI algorithm-based control system for automated driving facilitates more precise trajectory control in various driving ...

The new protocol stack is designed to enable secure and precise distance measurement between two Bluetooth LE-connected ...

Infineon has introduced 300-mm power GaN wafer technology within a scalable, high-volume manufacturing environment.

THine is set to debut an optical DSP-less chipset supporting PAM4 64-Gbps for PCIe 6.0 at this month’s ECOC 2024 exhibition ...

Sharp has built a state-of-the-art anechoic chamber in Japan to measure the performance of flat panel antennas for LEO and ...

Faraday has unveiled an advanced packaging service that simplifies chiplet integration by coordinating various vendors and ...

A 40 G UCIe IP comprising PHY, controller, and verification IP claims to offer 25% more bandwidth than the UCIe 2.0 ...

Two Hall-effect switch families, the unipolar AH332xQ and omnipolar AH352xQ from Diodes, offer a range of operating sensitivity options. The automotive-compliant ICs are suitable for a wide range of ...

D and 3D packaging improve system bandwidth and power efficiency by increasing I/O routing density and reducing I/O bump size ...

Navitas has released a portfolio of third-generation automotive-qualified SiC MOSFETs in D2PAL-7L and TOLL surface-mount ...

Chiplet designs demand versatile interconnect solutions that minimize die-to-die latency and support a variety of packaging ...

A design idea that uses brute force to mitigate of PWM Vdd and ground voltage deviations to improve PWM performance.