Design And Reuse

Siemens launches Fuse EDA AI Agent for automation across semiconductor, 3D IC and PCB system workflows

Fuse EDA AI Agent builds upon Siemens’ Fuse™ EDA AI system, which features a sophisticated RAG pipeline, a multimodal EDA-specific data lake, specialized parsers for EDA file formats, customizable ...
Design And Reuse

Chip Foundry TSMC Says Its Sales Rose 22% In February

The chip foundry, better known as TSMC, said its sales in February increased 22.2% in local currency from the same month last year to the equivalent of $10 billion. However, TSMC's sales dropped 20.8% ...
Design And Reuse

Soitec and NSIG to agree extension of licensing framework

The agreement with NSIG subsidiaries Simgui and Simwings extends the existing licensing framework underpinning their longstanding partnership, with no new technology transfer and a joint commitment to ...
Design And Reuse

Klepsydra Technologies and BrainChip Announce Strategic Partnership to Deliver Heterogeneous AI Runtime for Akida™ Neuromorphic Processors

Klepsydra Technologies, a leader in high-performance edge computing software, and BrainChip Holdings Ltd (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), the world’s first commercial producer of ultra-low-power, ...
Design And Reuse

Keysight Introduces New 224G Test Solutions to Enable 1.6T Optical Network Validation

Keysight Technologies, Inc. (NYSE: KEYS) today introduced new 224G test solutions that expand its 1.6T end-to-end portfolio, addressing the growing R&D validation and manufacturing challenges of ...
Design And Reuse

BrainChip Enables the Next Generation of Always-On Wearables with the AkidaTag© Reference Platform

BrainChip Holdings Ltd. (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), the world’s first commercial producer of ultra-low-power, fully digital, event-based neuromorphic AI, today announced at Embedded World in ...
Design And Reuse

Ceva’s NeuPro-Nano NPU Wins Artificial Intelligence Award at embedded world 2026

(NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, today announced that its Ceva-NeuPro-Nano neural processing unit NPU IP has won the Artificial Intelligence category ...
Design And Reuse

IBM, Lam Research Focus High-NA EUV on Sub-1-nm Nodes

IBM and Lam Research have a five-year agreement focused on developing new materials, fabrication processes, and High-NA EUV lithography to advance IBM’s logic scaling roadmap, the companies said in a ...
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Advancing High‑Performance Silicon Photonics and Silicon Germanium (SiGe) for the Next Era of Optical Connectivity

As a compliment, Silicon Germanium (SiGe) remains a critical enabler of high‑performance optical transceivers – powering the analog and mixed‑signal electronics that drive and receive optical signals.
Design And Reuse

GlobalFoundries Announces Pricing of Public Secondary Offering and Concurrent Share Repurchase

GlobalFoundries (Nasdaq: GFS) (GF) today announced the pricing of a secondary public offering of 20,000,000 ordinary shares to the public at a price to the public of $42.00 per share and $300 million ...
Design And Reuse

Faster and more energy-efficient electronics with 3D chip design

Mick Posner highlights Cadence’s chiplet platform to support physical AI development. What is included in Cadence’s Physical AI Chiplet Platform? What is the Chiplet Spec-to-Packaged Parts ecosystem?
Design And Reuse

SEMIFIVE Signs Turnkey Design Contract Worth KRW 18,000 Million With AI Semiconductor Fabless Company

SEMIFIVE announced that it has signed a turnkey design contract worth KRW 18,000 million (approximately USD 12.5 million) with an AI semiconductor fabless company. This contract marks a follow-on ...