HSINCHU, Taiwan –TSMC today announced its 6-nanometer (N6) process, which provides a significant enhancement of its industry-leading N7 technology and offers customers a highly competitive performance ...

TAIPEI, TAIWAN — Paradetech held its 2013 fourth quarter investor conference on Thursday, two series of new products are going to be its Figure 1 During December of 2013 and January of 2014, Parade ...

HSINCHU, Taiwan - eMemory and United Microelectronics Corporation today announced that eMemory’s Resistive Random Access Memory (RRAM) IP has been qualified on UMC’s 22nm ultra-low power process, ...

Holtek announced the release of its new wireless charger transmitter Flash MCU, the HT66FW2350. The device includes a host of wireless charger transmitter required functions such as AM demodulation ...

esmo group (esmo) announced the launch of ares auto setup, the world’s first final test manipulator capable of automated test head finding and positioning. esmo group (esmo) announced the launch of ...

Taoyuan, Taiwan - Inotera Memories, Inc. today announced the appointment of Mr. Richard Mealey-Ozawa as Chief Financial Officer, effective August 9th, 2016. TAIPEI, Taiwan - Taiwanese memory ...

Broadcom today introduced the BCM53570 Ethernet switch family that is the industry’s first to offer full compliance with all available IEEE Time Sensitive Networks (TSN) standards. Broadcom ...

Samsung Electronics today announced the immediate availability of its silicon-proven 3D IC packaging technology, eXtended-Cube (X-Cube), for today's most advanced process nodes. Leveraging Samsung's ...

Renesas Electronics expanded its robust lineup of 32-bit microcontrollers (MCUs) with the RX24T Group. Using the RXv2 CPU core, the new MCUs deliver double the performance from the RX23T, 30 percent ...

TAIPEI, Taiwan - Market Intelligence & Consulting Institute (MIC) has conducted a “Smart Speaker Consumer Survey” aimed at Taiwanese consumers and found that 21% of consumers already utilize smart ...

Shipment Volume of the Global 5G CPE (Customer Premises Equipment) industry is estimated to reach 5.6 million units in 2021, up 58.9% compared to 2020, according to MIC (Market Intelligence & ...

STMicroelectronics and GlobalFoundries announced they have signed a Memorandum of Understanding to create a new, jointly-operated 300mm semiconductor manufacturing facility adjacent to ST’s existing ...