As Machine Design’s technical editor, Sharon Spielman produces content for the brand’s focus audience—design and multidisciplinary engineers. Her beat includes 3D printing/CAD; mechanical and motion ...
Abstract: The through-silicon-via (TSV) interposer is expected to be the driving vehicle for 2.5-D integrated circuit integration. Although a number of studies have been reported on the ...
Some objects provide named attachable parts that you can select instead of using the main geometry for the object. One important kind of attachable part is the inside of a tube. The anchors are all on ...
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