TEOS 3D offers ultra-thick inter-die gapfill by leveraging bowed wafer handling and advancements in dielectric deposition.

Sometimes you don't want to go too hard, you just want a nice little game where you transform a million hexagons of barren oblate spheroid into a lush new home for humankind with an atmosphere, plants ...

Your guide to what Trump’s second term means for Washington, business and the world A couple of weeks ago, a story emerged in Washington that was likely to make any chief executive officer shudder: ...

How do you fancy finding love in the sun? ITV2 are looking for vibrant singles from across the UK who want to head to the sun, in search of love! The chosen cast will spend time in a luxury villa, ...

The new Harry Potter is taking shape with Warwick Davis making his return for the HBO TV reboot. It’s been 14 years since the final part of Harry Potter and the Deathly Hallows apparated onto the big ...

Javascript is required for you to be able to read premium content. Please enable it in your browser settings.

Abstract: Quantum circuit simulation is playing a critical role in the current era of quantum computing. However, quantum circuit simulation suffers from huge memory requirements that scale ...

Abstract: We propose a parameteric geometry-based nonintrusive model order reduction (NIMOR) model for electromagnetic simulation in domains of different shapes. The free-from-deformation method is ...