The XENSIV PAS CO2 5V provides accurate air quality data in real time. Its miniaturized form factor of 14x13.8x7.5 mm³ is ...

Chiplet Summit helps educate both design and packaging engineers. The advanced packaging tutorial covers methods such as 3D, wafer-scale, and panel-scale. The Working with Foundries tutorial then ...

“PI has been on a steady growth path for years. With the new building, we are meeting our customers' increasing demands for modern, future-proof development and production facilities,” emphasizes ...

His charter includes the delivery of design platforms for both Intel and external foundry technologies and the related design ...

The technological breakthrough will be an industry game-changer and enable us to unlock the full potential of gallium nitride. Nearly one year after the acquisition of GaN Systems, we are ...

SiMa.ai ONE Platform for Edge AI is a software-centric framework offering compatibility across the entire MLSoC platform family to provide a seamless experience for upgrades, transitions and ...

Faraday Technology, a leading ASIC design service and IP provider, has introduced its advanced packaging coordinated platform for the vertical disintegration of chiplets. This unique platform ...

Xenics, part of Exosens, announces the expansion of its advanced imaging solutions with the launch of Cheetah+ series.

Recently, India Prime Minister Narendra Modi laid the foundation stones for two Tata Electronics facilities, including a ...

In recent years, Dirac has also grown significantly through partnerships with leading semiconductor companies like NXP, ...

Xiphera, Ltd, a Finnish company designing and implementing hardware-based security solutions, announces a project for ...

Leading semiconductor test equipment supplier Advantest Corporationwill feature its leading-edge IC test solutions at the ...