MATERIALS: Master Bond has introduced a thermal adhesive film called FL901AO. It is formulated to function as the preferential heat-transfer path between heat-generating components and heat sinks or ...

Today I upgraded the CPU/HSF on my motherboard. The previous CPU was a Ryzen 5 3600 using a Neptwin Deepcool HSF and Noctua NT-H2 paste, which is not advertised for its' adhesive properties.

The Supreme 11AOHT is a room temperature curing epoxy adhesive featuring excellent electrical insulation properties and high thermal conductivity. The Supreme 11AOHT is a room temperature curing epoxy ...

The Liqui-Bond SA 3505 high thermal conductivity adhesive offered by Bergquist helps save the costs and time associated with clip or screw fastening of heatsinks in Power Supplies and discrete ...

is there an alternative to thermal glue?<BR><BR>I have a 3dfx voodoo 3 2000 that the heat sink came off of the gpu. I have looked all over town and can not find any thermal epoxy, the guy at radio ...

With an eye on the thermometer in high-heat applications, the EP24AN two-component epoxy adhesive exhibits a thermal conductivity in excess of 22 BTU/in./ft.2/hr./°F. In terms of electrical insulation ...