Ring-oscillator process monitors give production test teams a fast on-die frequency measurement for identifying CMOS process ...

Wafer-to-wafer hybrid bonding process capable of achieving a 200-nanometre copper interconnect pitch demonstrated.

Asymmetries in wafer map defects are usually treated as random production hardware defects. For example, asymmetric wafer defects can be caused by particles inadvertently deposited on a wafer during ...

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

In an update to its annual International Technology Roadmap for Photovoltaics, German engineering association VDMA discusses the readiness level for various technologies in PV cell and module ...

The Chinese module maker and the Australian National University utilized phosphorus diffusion gettering and another defect mitigation strategy to improve the quality of n-type wafers. The proposed ...

For decades, chipmakers squeezed more transistors onto processors by shrinking them sideways. That playbook is running out of ...

Collaborative R&D at Applied’s EPIC Center in Silicon Valley will enable higher yields and faster commercialization of next-generation chips; Partnership deepens long-standing j ...

Silicon is the second most abundant element in Earth’s crust, but is rarely found in pure form. High-purity quartzite (SiO 2) is reduced in an electric arc furnace at around 1,800 °C using carbon ...

Purdue University has announced a strategic partnership with GeChi Compound Semiconductor (GCCS) aimed at ...