BE Semiconductor leads in die-attach tech for AI chips, with strong 2026–2028 growth expected from advanced packaging demand.

Multi-die assemblies are becoming more common and more complex due to technology advancements and market demands, but differing die dimensions are making this process increasingly challenging. To ...

Hybrid bonding is becoming the preferred approach to making heterogeneous integration work, as the semiconductor industry shifts its focus from 2D scaling to 3D scaling. By stacking chiplets ...