Directed self-assembly (DSA) is moving back onto the patterning radar screen amid ongoing challenges in lithography. Intel continues to have a keen interest in DSA, while other chipmakers are taking ...

Imec has demonstrated the capability of directed self-assembly (DSA) to pattern line/spaces with a pitch as small as 18nm, using a high-chi block copolymer (high-χ BCP) based process under high volume ...

There are still some problems to work out, such as cutting defect rates, but directed self-assembly has the potential to reduce the total number of masks. The upcoming 7nm process node presents tough ...

Through microphase separation, block copolymers (BCPs) can self-assemble into highly uniform, chemically distinct, periodic domains with dimensions and periods at scales of 3–200 nm 1,2 that are ...